IoT alone is not enough. Build trust into the chip itself.

Kyndrava is not limited to protecting IoT devices alone. As a multi-layer blockchain security approach, it aims to build a foundation of trust into chip-equipped products across broader industrial and operational environments.

Business inquiries include direct deployment, customer-side embedding, PoC, joint research, channel partnerships, and partner-company consultation.

Business and partner categories

Semiconductor design
Fabless / IDM

Foundry / manufacturing
Front-end / production

OSAT / test
Back-end / packaging

Equipment / materials / parts
Supply-chain related

OEM / ODM / EMS
Productization / manufacturing

Embedded / firmware / board
System integration

Industrial / automotive / medical / telecom
Chip-equipped product operators

Resellers / channel partners
Sales and partnership

Common topics

Direct internal deployment
Embedding into customer products
PoC / evaluation deployment
Joint research / technical partnership
Channel / reseller discussion
Operational messaging / e-learning rollout

For semiconductor partners For manufacturing / OEM / ODM / EMS Partner Inquiry Form Messaging / E-learning

Patent Pending Technology

Enterprise-grade trust and judgment flow

AURA / Kyndrava is designed around evidence integrity and controlled response. The patent pending concept connects blockchain-recorded event information with judgment requests to three or more endpoints before qualified restrictions are applied.

Japanese Patent Application No. 2026-079093

See the patent pending overview